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Proceedings, 1995 IEEE Multi-Chip Module Conference, January 31-February 2, 1995, Santa Cruz, California 🔍
IEEE Circuits and Systems Society, Components, Packaging & Manufacturing Technology Society, IEEE Electron Devices Society, sponsored by IEEE Circuits and Systems Society ... [et al.], in cooperation with IEEE Computer Society Wiley-IEEE Computer Society Press, 1995, 1995
英语 [en] · PDF · 34.2MB · 1995 · 📗 未知类型的图书 · 🚀/duxiu/zlibzh · Save
描述
The IEEE Multi-Chip Module Conference (MCMC) brings together elements of packaging technology and design, circuits and system design, computer-aided design, modeling, analysis, and education. The proceedings of MCMC'95 comprise papers and posters on manufacturing issues, applications, field programmable MCMs, electrical design, optimal system design for MCMs, analysis and simulation methods, and advances in MCM technologies. No index. Annotation copyright by Book News, Inc., Portland, OR
备用文件名
zlibzh/no-category/IEEE Circuits and Systems Society, Components, Packaging & Manufacturing Technology Society, IEEE Electron Devices Society, sponsored by IEEE Circuits and Systems Society ... [et al.], in cooperation with IEEE Computer Society/PROCEEDINGS 1995 IEEE MULTI-CHIP MODULE CONFERENCE_37469772.pdf
备选标题
1995 Ieee Multi-chip Module Conference: Proceedings : January 31-february 2, 1995 : Santa Cruz, California (mcmc `95)
备选标题
Proceedings : 1996 IEEE Multi-Chip Module Conference, February 6-7, 1996, Santa Cruz, California
备选标题
1996 Ieee Multi-chip Module Conference: February 6-7, 1996 Santa Cruz, California : Proceedings
备选标题
Multi-Chip Module Conference, 1996 IEEE (MCMC-96)
备选标题
Multi-chip module conference : Papers
备选作者
Institute of Electrical and Electronics Engineers, Inc. Staff
备选作者
Calif.) Ieee Multi-chip Module Conference (1995 : Santa Cruz
备选作者
IEEE Multi-Chip Module Conference (1995 Santa Cruz, Calif.)
备选作者
IEEE Multi-Chip Module Conference (1996 Santa Cruz, Calif.)
备用版本
United States, United States of America
备用版本
Los Alamitos, Calif, California, 1994
备用版本
Los Alamitos, Calif, California, 1996
备用版本
Los Alamitos, Jan. 1995
备用版本
Los Alamitos, Feb. 1996
备用版本
January 1995
备用版本
January 1996
元数据中的注释
related_files:
filepath:40117945.zip — md5:601492613a2f550d0d7acb3e17b2b100 — filesize:42922420
filepath:40117945.zip — md5:3b0c106aepbf5f8e1691f46784d106d1 — filesize:42922420
filepath:/读秀/读秀4.0/读秀/4.0/数据库21-2/40117945.zip
filepath:第一部分/05-2/40117945.zip
元数据中的注释
"IEEE Computer Society Press order number PR6970"--T.p. verso.
"IEEE catalog number 95CH35726"--T.p. verso.
Includes bibliographical references and index.
元数据中的注释
"IEEE Catalog Number 96CH35893"--T.p. verso.
Includes bibliographical references and index.
备用描述
Considers multi-chip modules from perspectives of packaging, technology and design, circuits and systems design, computer- aided design, modeling, analysis, and education. The 37 papers focus on such specific topics as wireless communications, large- area pixel detectors, fluxless flip-chips, memory hierarchy organizations, chip and package co-design techniques for clock networks, and polymer optical couplers. No subject index. Annotation copyright by Book News, Inc., Portland, OR
开源日期
2024-06-13
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