DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ \_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_ o~ \_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_ \_\_ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep­ tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure­ ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en­ gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac­ tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina­ tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.

lgrsnf/A:\compressed\10.1007%2F978-1-4613-0507-1.pdf

nexusstc/Computer Vision for Electronics Manufacturing/6afa517763f84b91c53644cb929d4b6e.pdf

zlib/Computers/Networking/L. F. Pau (auth.)/Computer Vision for Electronics Manufacturing_2111226.pdf

by L.F. Pau

Plenum Press

Advances in Computer Vision and Machine Intelligence, Advances in computer vision and machine intelligence, Boston, MA, Massachusetts, 1990

Advances in computer vision and machine intelligence, New York, ©1990

United States, United States of America

Springer Nature, New York, NY, 2012

1, 2011

lg957327

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DEFECT PROPORTION OF DETECTION INITIAL RATE DETECTION RATE INSPECTOR 3 COMPLEXITY OF TIMES PAN OF PERFORMING o~ ________________________ o~ ______________________ __ -;. INSPECTION TASK -;. VISUAL INSPECTION Fagure 1. Trends in relations between the complexity of inspection tasks, defect detection rates (absolute and relative), and inspection time. Irrespective of the necessities described above, and with the excep tion of specific generic application systems (e.g., bare-board PCB inspection, wafer inspection, solder joint inspection, linewidth measure ment), vision systems are still not found frequently in today's electronics factories. Besides cost, some major reasons for this absence are: 1. The detection robustness or accuracy is still insufficient. 2. The total inspection time is often too high, although this can frequently be attributed to mechanical handling or sensing. 3. There are persistent gaps among process engineers, CAD en gineers, manufacturing engineers, test specialists, and computer vision specialists, as problems dominate the day-to-day interac tions and prevent the establishment of trust. 4. Computer vision specialists sometimes still believe that their contributions are universal, so that adaptation to each real problem becomes tedious, or stumbles over the insufficient availabIlity of multidisciplinary expertise. Whether we like it or not, we must still use appropriate sensors, lighting, and combina tions of algorithms for each class of applications; likewise, we cannot design mechanical handling, illumination, and sensing in isolation from each other.
Erscheinungsdatum: 17.09.2011

Front Matter....Pages i-xvi
Introduction and Organization of the Book....Pages 1-4
Front Matter....Pages 5-5
Vision System Components....Pages 7-31
Imaging Microscopes for Microelectronics....Pages 33-52
Metrology in Electronic Devices and Substrates....Pages 53-59
Inspection of Integrated Circuits and Gate Arrays....Pages 61-86
Sensor Fusion for Integrated Circuit Testing....Pages 87-104
Wafer Inspection....Pages 105-115
Mask Repair and Inspection....Pages 117-125
Knowledge-Based Processing....Pages 127-131
Design Rule Verification....Pages 133-139
Printed Circuit Board (PCB) Inspection....Pages 141-160
Inspection for Assembly Tasks....Pages 161-185
Knowledge-Based Printed Circuit Board Manufacturing....Pages 187-206
Front Matter....Pages 207-207
Image Quantization and Thresholding....Pages 207-213
Geometrical Corrections....Pages 215-219
Image Registration and Subtraction....Pages 221-231
Edge and Line Detection....Pages 233-241
Region Segmentation and Boundaries....Pages 243-248
Geometry of Connected Components and Morphomathematics....Pages 249-264
Feature Extraction....Pages 265-276
Front Matter....Pages 207-207
Decision Logic....Pages 277-279
Image Data Structures and Management....Pages 281-285
Conclusion: The Future of Computer Vision for Electronics Manufacturing....Pages 287-288
Back Matter....Pages 289-322

2013-08-01