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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects 🔍
Günter Grossmann (auth.), Günter Grossmann, Christian Zardini (eds.) Springer-Verlag London Limited, 1, 2011 may 13
英语 [en] · PDF · 8.3MB · 2011 · 📘 非小说类图书 · 🚀/lgli/lgrs/nexusstc/scihub/upload/zlib · Save
描述
__The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects__ is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering.
The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints.
__The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects__ is written for scientists, engineers and researchers involved with lead-free electronics.
备用文件名
nexusstc/The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects/62464e653af44c8d305c53d0be0d4932.pdf
备用文件名
lgli/_417841.62464e653af44c8d305c53d0be0d4932.pdf
备用文件名
lgrsnf/_417841.62464e653af44c8d305c53d0be0d4932.pdf
备用文件名
scihub/10.1007/978-0-85729-236-0.pdf
备用文件名
zlib/Engineering/Günter Grossmann (auth.), Günter Grossmann, Christian Zardini (eds.)/The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects_1124179.pdf
备选作者
Günter Grossmann, Christian Zardini, editors
备选作者
Grossmann, Günter., Zardini, Christian.
备用出版商
Springer Verlag
备用出版商
Scholars Portal
备用版本
United Kingdom and Ireland, United Kingdom
备用版本
London, New York, Unknown, 2011
备用版本
Springer Nature, London, 2011
备用版本
1st ed. 2011, London, 2011
备用版本
Dordrecht, 2011
备用版本
2019
元数据中的注释
до 2011-08
元数据中的注释
sm22801158
元数据中的注释
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元数据中的注释
Incudes bibliographical references.
备用描述
Front Matter....Pages i-viii
Deformation and Fatigue of Solders....Pages 1-18
Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints....Pages 19-63
Thermal Fatigue Analysis....Pages 65-79
Electrochemical Behaviour of Solder Alloys....Pages 81-103
Void Formation by Kirkendall Effect in Solder Joints....Pages 105-122
Tin Whiskers....Pages 123-159
Electromigration in Solder Interconnects....Pages 161-178
Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold....Pages 179-195
Reliability of Electronic Assemblies Under Mechanical Shock Loading....Pages 197-225
Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration....Pages 227-253
Lead-Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass-Reinforced Epoxy Laminates....Pages 255-274
PCB Delamination....Pages 275-282
Excessive Warpage of Large Packages During Reflow Soldering....Pages 283-296
Popcorn Cracking....Pages 297-303
Thermal Capability of Components....Pages 305-313
备用描述
Keine Beschreibung vorhanden.
Erscheinungsdatum: 14.05.2011
备用描述
0857292358,9780857292353
Springer 2011
开源日期
2011-08-31
更多信息……

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